Abstract
Aspects In the grinding of ceramics have been investigated. Si3N4, ZrO2, SiC, and Al2O3 were ground with resin‐bonded diamond wheels of grit numbers ranging from 80 to 800. Microstructural observations of ground surfaces show that grinding occurs predominantly by flow mode in Si3N4 and ZrO2, and by fracture and grain pullout in SiC and Al2O3. The measurement of grinding force shows that grinding resistances in Si3N4 and ZrO2 are significantly larger than those in SiC and AI2O3. As the grit number of the grinding wheel increases, maximum surface roughness significantly decreases in Si3N4, ZrO2, and SiC, but it apparently does not change in AI2O3. This unexpected result in AI2O3 is discussed in terms of the observed grinding mode and microstructure.
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