Abstract
We report the results of in situ arsenic doping in HgCdTe layers grown by molecular beam epitaxy (MBE). Arsenic incorporation was carried out by two mechanisms called conventional doping and planar doping. The obtained results indicate that for both mechanisms, after Hg anneal, arsenic was successfully incorporated as an acceptor during the MBE growth. Secondary ion mass spectrometry and Hall-effect measurements before and after Hg annealing were used to characterize arsenic activity in the grown layers. Close to 100% acceptor doping efficiency with arsenic has been obtained on these MBE grown layers up to total arsenic concentrations of approximately 2×1018 cm−3, which is more than sufficient for a wide range of infrared devices. At much higher total arsenic concentrations, electrical activity falls off drastically as the doping level saturates.
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