Abstract
The diffusion from CoSi2 layers, implanted with As and B ions, into the underlying Si substrate has been studied by a high-resolution carrier delineation technique. In the early stages of diffusion the junction shape follows the silicide/silicon interface for B, while it is deeper near the CoSi2 grain boundaries for As. The different behaviour is related to the different diffusion mechanisms of As and B in the silicide layer. Using a two-step anneal or a thin silicide diffusion source a laterally uniform junction has also been obtained for As-implanted CoSi2. The diffusion coefficients of arsenic and boron in silicon have been measured by this technique. The measured diffusivity values for boron and arsenic are very close to the data reported in the literature.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.