Abstract
Optical fibers are of potential use in data links for computers and switching systems.1 As in the case of integrated circuits, the cost and size of the electro-optical interfaces can be decreased by using a batch fabrication process, by having several optical devices sharing an identical package, and by placing several optical devices and integrated circuits together in a single package. This integration of fiber optics and integrated circuits technologies poses a new challenge for IC packaging because a package must include electronic components, electro-optical interfaces, electrical connections, and optical connections.
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