Abstract
Since the 1960s, interconnection technology has been dominated by implementations of printed circuit board (PCB) technology. However, in response to the ever increasing demand for higher routing densities and improved electrical performance, this technology has been increasingly challenged by multichip module (MCM) technology and in particular the MCM‐L type. MCM‐L technology is a laminate construction and is basically a further development of PCB technology with two or more bare chips and fine line interconnects. Consequently, it is perceived that the current PCB fabricators are ideally positioned to take the initiative with MCM‐L technology. Reviews the current state of PCB industry and MCM‐L technological (process and material) requirements, within the UK, such that a comparison can be made between the two technologies. Planning, training and investment requirements for new technology implementation are then identified and compared with PCB fabricators’ technological, training, planning and investment capabilities. The shortfalls between MCM‐L fabrication requirements and PCB fabricators capability are identified and discussed.
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