Abstract

Solution-processed indium oxide (In2O3) thin films have been studied widely as active layers for transparent semiconducting devices because of their high charge carrier concentration, low absorbance, simple fabrication methods, and low cost. Several studies on improving the electrical characteristics of thin-film transistors (TFTs) by optimizing and fine-tuning the fabrication process and using various post-deposition treatments have been conducted to take full advantage of these semiconductor films in high-performance electronics. This study examined the effects of a focused plasma (FP) treatment on In2O3 thin films prepared using a simple solution process at 250 °C. The effects of the FP generated from N2 gas and two gas mixtures (N2-H2 and N2-H2-O2) on the electrical performance of the TFTs were analyzed. The FP treatment enhanced the electrical properties of the device, and the specific performance and stability parameters were improved by the treatment conditions. X-ray photoelectron spectroscopy showed that the FP treatment could effectively control the oxygen vacancies and carrier concentration in the solution-processed In2O3 thin films. Therefore, an FP beam is a viable method for optimizing In2O3 TFTs prepared at low temperatures for application in high-performance transparent electronic devices.

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