Abstract
The mechanical strength and structural integrity of a high-Tc superconductor may play a decisive role when a superconducting material is used for practical purposes. In this analysis, we suggest a simple analytical model for an approximate evaluation of the elastic thermal stresses in elongated thin films in application to high-Tc superconducting ceramics. The emphasis is on interfacial shearing and peeling stresses responsible for the integrity of the film-substrate composite and the strength of the intermediate material, if any. A numerical example is performed for a superconducting ceramic YBa2Cu3O7-δ deposited on a Si. GaAs, Al2O3 or MgO substrate. It is shown that the thermally-induced stresses und strains can be brought down by reducing the thermal expansion (contraction) mismatch of the film and the substrate, the fabrication temperature, and Young's modulus of the film material. Our theory is equally applicable to other film structures as long as the materials involved can be treated as linearly elastic.
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