Approaches for improvement of EDM cutting performance of SiC with foil electrode

Abstract

Electrical discharge machining by foil electrode serves as an alternative method for SiC slicing. This technology uses a highly tensioned thin foil as the tool electrode. The main advantages over wire EDM are that the foil thickness can be made smaller than the wire diameter, vibrations can be avoided by applying high tension, and higher current can be supplied since there is less risk of tool breakage. However, due to the large side surface area of the foil electrode, there is a high occurrence probability of side surface discharges and high concentration of debris, which affects kerf width accuracy and machining stability. In the aim to overcome both problems, this study proposes two foil electrode designs: a foil electrode in which holes are machined and the insulation of the side surface areas by a resin coating layer of 5μm thickness. The influences of both foil electrodes were tested with three different slicing strategies: no strategy, applying jump motion of the tool electrode, and applying reciprocating motion. From machining experiments and comparative studies of the discharge delay time, it was found that with both foil tools, the occurrence probability of side surface discharges can be reduced. In addition, the chip pocketing effect of the holes enhance the flushing conditions, resulting in a higher cutting speed.