Abstract
Layered film structures are widely applied. The adhesiveness of thin layer, which controls the product quality, is a key factor to be known. The possibility of applying the surface acoustic waves (SAWs) technique to determine the adhesiveness quality of film and substrate is explored by a theoretical approach, where the interface adhesiveness is modeled by the spring model. Numerical results show that the proposed SAWs technique has a high resolution on determining the interface adhesiveness. Meanwhile, SAWs can also be applied to detect the parameters of film such as the elastic modulus, thickness, density, and Poisson's ratio nondestructively.
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