Abstract
This study aimed to improve the touch responses of electronic products. The improvement method was based on six sigma improvement steps. Product quality was improved using define, measure, analyse, improve, control (DMAIC) and statistical quality control methods to reduce the cost and waste of defective products. The project identified five critical processes from the manufacturing process and eight critical to characteristics (CTCs). Then CTCs were identified through the critical to characteristic diagram. The root causes were verified using the experimental plan method, scatter diagram, and double ratio test. This study identified three root causes, namely ‘poor reed touch value’, ‘base cavity width’, and ‘jig precision’. The last two causes were evaluated, and countermeasures were taken to ‘change the size of the base cavity’, ‘change the design of the assembly jig’, and ‘change the process of the assembly jig’. The target rate of the overall product defect rate reached 127%.
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