Abstract
AbstractTo address the wide variety of solder joint configurations, the authors have developed and applied a physics‐of‐failure model to predicting the service life of solder joints under thermal cycling conditions. The wide variety of solder joint geometries, materials and environments makes it impractical to develop and apply empirical models to predicting the service life of solder joint interconnects. On the other hand, a physics‐of‐failure model that describes the failure mechanisms in solder joints can be applied to a wide range of conditions. The physics‐of‐failure model framework is described and a model is demonstrated for predicting the failure of a leadless surface mount solder joint under slow thermal cycling conditions.
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