Abstract
This paper reports the use of X-ray radiography and computer image processing for the study of porosities in surface mount solder joints fabricated from different types of no-clean RMA and RA solder pastes. In order to understand the mechanism of pore formation in the solder joints, experiments are conducted on the processes of the pore formation during reflow soldering. The effects of different infrared (IR) reflow temperature profiles are also studied. From this work, it was found that the composition and structure of solder pastes had a significant effect on the pore formation, and the lower metal content and/or higher heating rate did not necessarily cause a greater percentage of pore formation in the solder joints. X-ray radiography, in conjunction with Optimas image processing, is shown to be very useful in quantitatively testing pores in surface mount solder joints and allows real-time radiographic image processing.
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