Abstract
Abstract Since the inception of solid circuit technology, thin films have been an essential feature of the integrated circuit, providing interconnections on the silicon chip. The main practical problems associated with them have been lack of adhesion, corrosion and electromigration and these will be reviewed. Thin film circuits are used in hybrid microelectronics and applications and examples will be quoted. The appearance of viable thin-film transistors has opened the way to all- thin-film integrated circuits. These need not be expensive to produce and, in some cases, will be competitive with LSI solid circuits. The TFT is particularly suited to large-area applications such as display panels.
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