Abstract
The development of polyimide films in Japan is discussed. The chemical structure of the films and their polymerization mechanisms are described. Types of polyimide films are identified, and their characteristics are examined. Special attention is given to their thermal and chemical properties and their radiation resistance. Applications of polyimide films to rotating machines, integrated circuits, tape-automated bonding, flexible printed-circuit boards, electric wires, aerospace and nuclear equipment, and recording devices are discussed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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