Abstract
A special finite-element method for multiple laminated structure, previously proposed by the authors, is presented here. It can provide attractive results without three-dimensional finite-element discretization and can be applied to electronic packaging problems. The thermal stress analysis of the basic IC model, the practical IC model with lead fingers and the electronic printed board with solder bump joints are selected as the problems to deal with, and analyzed in detail. From the results of the basic IC model, the influences of varying chip size and package thickness for the stress distributions, are presented. The causes of failure for the real IC device are presented from the results of the practical IC model. In addition, influences of the solder joint arrangements for the thermal stresses are presented from the results of the electronic printed board with solder bump joints.
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