Abstract
Recent advances in the development of the Micron Scale Connector (MSC) system described in this paper shows the current state of development and applications for this advanced connector technology. MSC connectors can provide contact pitch spacing to 0.25 millimeters (10 mil) enabling the creation of application specific high-density connector systems for use in high performance electrical systems in spacecraft, hand held and remote assembly applications. These applications are being driven to lower size and weight requirements by increasing circuit integration, launch costs and consumer demand. To realize the goals a shift in the interconnection paradigm towards a more adaptable interconnection system has been made with the MSC system. This system will enable the reduction of system volume and weight by providing the necessary high-density interconnections in a form factor that is more user friendly.
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