Abstract
Abstract Thin section of rock is a highly technical work in the laboratory, and its application in logging site and rock identification is helpful to solve geological problems quickly in the process of exploration drilling. The cuttings samples cover a variety of lithologies, including sandstone and volcanic rocks with significant diagenetic differences. Due to the special properties of the cuttings, such as loose, fear of water, moisture absorption, brittleness, large hardness differences, inconsistent particle size, and not easy to penetrate glue, the production process has been challenged. In the temperature and humid environment, the cuttings are very susceptible to delixing, especially in the cuttings with cleavage development, more cracks and poor diagenesis. After the sticking sheet is affected by vibration during rough grinding, it is easy to produce warping edge and warping Angle, which leads to the destruction of the original structure of the mineral. The previous production process cycle is long, the operation is relatively not convenient, especially in the grinding into the international standard 0.03mm thick pieces there are certain difficulties. Therefore, it is very important to improve and optimize the rock wafer technology. This will help improve the efficiency of the production of cuttings and reduce the likelihood of damage to mineral structures, which in turn can be used more effectively in exploration drilling sites and rock identification, providing faster and more accurate support for solving geological problems. The results of this study have important significance for improving the efficiency and convenience of the production process and improving the application prospect of the rock sheet technology.
Published Version
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