Abstract
Post-implant anneals of short (10-15 s) duration are compared with extended (10 min) furnace anneals for the fabrication of Be-implanted MBE-grown GaAlAs/GaAs heterojunction bipolar transistors. It is shown that the thermal pulse anneals can lead to improved Be-implant electrical activation in Ga 0.7 Al 0.3 As and GaAs, to improved contact resistance to Be-implanted GaAs, and to improved transistor characteristics. The transistor improvement is inferred to be due to a reduction in diffusion of the grown-in dopant profile.
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