Abstract
In this paper we take advantage of the phosphate film which has a porous structure, by phosphate process on the surface of nickel plated copper conductor so as to improve the bonding force of wire and ceramic layer; Through the study of resistance voltage breakdown after phosphate , phosphate liquid was determined Manganese dihydrogen phosphate for 3g100-1ml, Zinc Nitrate was 8g100-1ml, Sodium Fluoride was 0.45g100-1ml; Optimum temperature was 60°C and the appropriate time was 15min at the temperature of 60°C.
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