Application of metallic inks based on nickel-silver core–shell nanoparticles for fabrication of conductive films

Abstract

Conductive inks based on nickel nanoparticles (NPs) have attracted much attention as a low-cost replacement for the currently used silver and gold inks, for fabrication of printed electronic circuits and devices. Nickel NPs as a component of conductive inks should be stable against oxidation process at all stages of preparation of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, the oxidation resistance of the Ag layer and the conductive properties of the Ni core allowed the use of nickel-silver core–shell (Ni@Ag) NPs as the component of conductive ink. Thick films composed of Ni-Ag core–shell NPs were deposited on a glass substrate and then sintered at temperatures ranging from 250 °C–370 °C. The conductivity of Ni@Ag coatings after sintering at 350 °C reached 11% of that for a bulk nickel.