Application of line-scanning microscopy using a linear sensor in semiconductor industry: shape and thickness measurements

Abstract

This work aims at showing the applicability of a scanning-stage bench-microscope in bright-field reflection mode for wirebonding inspection of integrated circuits (IC) as well as quality assurance of tracks in printed circuit boards (PCB). The main issues of our laboratorial prototype arise from the use of a linear image sensor taking advantage of its geometry to achieve lower acquisition time in comparison to traditional (pinhole) confocal approach. The use of a slit-detector is normally related to resolution degradation for details parallel to sensor. But an improvement will surely arise using light distribution along line pixels of the sensor which establishes a great advantage in comparison to (pure) slit detectors. The versatility of this bench-microscope affords excellent means to develop and test algorithms. Those to improve lateral resolution isotropy as well as image visualization and 3D mesh reconstruction under different setups namely illumination modes. Based on the results of these tests tests both wide-field illumination and parallel slit illumination and detection configurations were used in these two applications. Results from IC wire-bonding show the ability of the system to extract 3D information. A comparison of auto-focus images and 3D profiles obtained using different 3D reconstruction algorithms as well as a method for the determination of the diameter of the bond wire are presented. Measurements of PCB track width and thickness were performed and the comparison of these results from both longitudinal and transverse tracks stress the limitations of a lower spatial sampling rate induced by the resolution of object stage positioners.