Abstract
Ionic contamination is a frequent cause of corrosion failures in electronics packaging. Ionic Cl −, SO 2− 4, Na + and K + are the species most frequently associated with corrosion and are easily detected by ion chromatography (IC) or other surface analysis techniques (XRF, EDX, etc). This paper will describe a corrosion problem, involving gold-plated copper wires and an automated wire bonding operation, and its solution using IC and Fourier transform infrared (FT-IR) analysis, which showed that the corrosion was caused by ionic NO 2 − and NO 3 −, species which are not easily detected by other surface analysis techniques.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
