Application of inverse heat conduction methods in temperature monitoring of integrated circuits

Abstract

This paper presents an analytical method for estimation and monitoring of IC temperature. The power dissipated in heat sources is estimated solving an inverse problem. For the calculations, the data read from temperature sensors and information about heat source position are given. After a short introduction to the problems, a brief overview of inverse heat conduction problems (IHCPs) is given followed by the detailed method description. Next, the method sensitivity to perturbations and possibility of error correction are discussed.