Abstract
A batch fabrication technology is described for the production of small niobium based Josephson junctions. This technology uses thermally oxidized silicon wafers as substrates, allowing maximum usage of silicon integrated circuit techniques and equipment. Patterns are produced in rf sputtered niobium films by sputter etching through masks generated by "step and repeat" photolithographic techniques. Typically over 600 junctions are fabricated at one time. Measurements of voltampere curves, Josephson current versus magnetic field, and self resonant step structure were made.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
