Abstract
Application of hot isostatic pressing (HIP) technology to diffusion bond refractory metals for proton beam targets and absorbers at CERN
Highlights
BUSOM DESCARREGA ET AL.In the framework of the Physics Beyond Colliders initiative at the European Laboratory for Particle Physics (CERN), a new infrastructure named beam dump facility (BDF) has been proposed to study the Hidden Sector
The hot isostatic pressing (HIP) parameters did not show significant effects on the bondings but a slight bonding strength reduction was observed for HIP cycle “H.” the use of interfacial aids shows a significant effect in the mechanical strength of the bonding: The strength of the TZM/TZM joint increased from 5 to 550 MPa and that of W/W improved from not bonded to 215 MPa
The bonding of Ta2.5W would not be completed for HIP cycle “L,” and interfacial strength is increased with the higher T and P from HIP cycle “H.” The same reasoning can be expressed for the target to target materials bonding: diffusion bonding with interlayer is already complete with HIP cycle “L” and increasing T and P leads to less strong bonding due to bulk material softening
Summary
The number of prototypes built for this study was determined in order to obtain all the combinations between target materials to cladding materials, target to target materials, the use of Ta interlayer, and HIP cycles. From all the specimens featuring apparent bonding, only the specimens between TZM‐Ta2.5W with interlayer and HIP cycle “H” showed significant reduced thermal conductivity: 73% with respect to the theoretical one. Additional hardness and thermal conductivity measurements were carried out on bulk material specimens from the prototypes to evaluate the effect of the HIP cycles on the material properties. No significant variations of the thermal conductivity were observed for the two HIP cycles
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