Abstract

With the rapid development of China's solid wood composite flooring industry, the market of solid wood composite geothermal flooring is gradually huge. The adhesives used in traditional solid wood composite geothermal flooring are mainly urea formaldehyde resin and phenolic resin. Its bonded wood-based panel has the problems of formaldehyde emission and poor waterproof. With the enhancement of people's awareness of safety and environmental protection, the problem of formaldehyde has attracted more and more attention. Looking for various formaldehyde free adhesives that can replace urea formaldehyde resin has become a research hotspot. Graphene oxide is a new carbon material with excellent properties, which has high specific surface area and rich functional groups on the surface. In this study, powdered oxygraphene material and isocyanate resin were mixed in different proportions to press the three-layer solid wood composite floor substrate, and the bonding strength and thermal conductivity were tested to investigate the effect of graphene oxide powder on the bonding and thermal conductivity of isocyanate resin. The experimental results show that the viscosity of the resin system increases with the increase of the amount of graphene oxide powder; Graphene oxide powder with mesh number of 250 can significantly enhance the bonding strength of isocyanate, But when the amount is too large (10%) on the contrary, the bonding strength decreases. Graphene oxide powder with mesh number of 50 does not significantly enhance the bonding strength; adding graphene oxide powder can improve the thermal conductivity of the floor. With the increase of the proportion of graphene oxide, the thermal conductivity, thermal conductivity and electrothermal conversion rate of the floor are significantly improved, but graphene oxide with mesh number of 50 is not as good as graphite oxide with mesh number of 250 Alkene increased significantly. The addition of an appropriate amount of graphene oxide fine powder reduces the infiltration of resin into wood, enhances the bonding performance and thermal conductivity, provides a new possible way for the application of graphene oxide material and isocyanate in the substrate of solid wood composite floor, and provides a certain practical basis for the manufacturing process and application technology development of thermal conductive floor and geothermal floor.

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