Abstract
The focused ion beam system has been widely used as a critical failure analysis tool as microprocessor technology advances at a ramping speed. It has become an essential step in failure analysis to reveal physical defects after electrical fault isolation. In the highly competitive and challenging environment prevalent at present, failure analysis throughput time is of utmost important. Therefore, a quick, efficient and reliable physical failure analysis technique is needed. This paper discusses the applications of FIB as a defect localization and root cause determination tool through the passive charge contrast technique and pattern FIB analysis.
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