Abstract
Electron beam lithography has been employed to study microcreep deformation and grain boundary sliding in pure copper. Fine electron-sensitive microgrids of an alloy of palladium and gold were developed on the surface of rectangular specimens. Interrupted creep tests were carried out at 723 K at two stress levels in an argon atmosphere. Creep strain and grain boundary sliding were determined by forming Moire fringes in a scanning electron microscope as well as from the displacement of the grid lines. Local distribution of creep strain inside the grains was found to be non-uniform. Grain boundary sliding exhibited a wavy behaviour.
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