Abstract
A novel silicon-containing polymer, SCMR (silylated clay minerals resist), has been developed for microlithography. SCMR was synthesized by reaction of the silicate sheet of chrysotile with dimethylvinylchlorosilane (DMVCS) and/or trimethylchlorosilane (TMCS). The structure of SCMR is estimated as a mixture of R1R2R3SiO, SiO3(OH), and SiO4 (R1, R2, R3: methyl or vinyl group). The silicon content of SCMR is 40–45 wt% and its O2-RIE resistance is 50 times as high as that of a novolak-based photoresist. SCMR has a high thermal stability and its profiles are not changed up to 300°C. SCMR is a negative working E-beam resist and has a high sensitivity, 2 µC/cm2, and a high resolution, 0.2-µm line and space. CMPR (clay minerals positive resist), consisting of SCMR and an acid generator, has been developed for a positive working E-beam resist. It has a high sensitivity, 0.2 µC/cm2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
