Abstract
Current market conditions demand that hard disk drive (HDD) manufacturers adopt advanced technology in every area of drive design to improve drive capacity and performance and simultaneously reduce unit cost. Head stack suppliers in HDD industry are constantly working on high density interconnect technologies to provide faster and higher capacity and cheaper head stack components for disk drives. A low cost method to manufacture HDD head using anisotropic conductive film (ACF) bonding for flex-to-flex interconnection has been developed. This paper describes the process selection work among the current and the newly developed ACF bonding technologies. Bond pad design for ACF process using the finite element analysis method is introduced. Critical process bonding parameters are identified and characterized to give the optimal bonding conditions. Reliability evaluations on the final assemblies indicated that ACF bonding could give a very reliable electrical and mechanical interconnection.
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