Abstract
A new mixed-potential integral-equation (MPIE) formulation is developed for the analysis of electromagnetic problems due to conducting or dielectric objects of arbitrary shape embedded in a planarly stratified medium. In the new MPIE formulation, the dyadic kernel of the vector potential is kept in the simple form originally developed by Sommerfeld. The scalar potential, which is related to the vector potential via the Lorenz gauge, is then represented by a double dot product of a dyadic kernel with a dyadic charge density. An extra line integral term, which is well behaved and nonsingular, will appear when the object penetrates an interface. The numerical implementation of the double dot product is found to be trivial if one takes advantage of the well-established basis functions in which the unknown current density is expressed. The new MPIE formulation is employed in conjunction with the triangular patch model to treat the problem of a dielectric resonator (DR) excited by microstrip circuit. A matched-load simulation procedure has been used to extract the network S-parameters of a DR microstrip circuit. The diameters of the Q circles have been measured to determine the coupling coefficients and the Q factors of the DR excited by a microstrip circuit. The validity of the new MPIE formulation and the numerical procedure have been verified by comparing the obtained S-parameters, with available measurement data.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Microwave Theory and Techniques
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.