Application in Self-Adsorption Pd Nanoparticles with High Adhesion

Abstract

Electroless plating (ELP) is widely used to metallize non-conductive substrates in printed circuit board industry. Due to the complexity of commercial palladium catalysts activation procedure and the high price of palladium, we synthesized a type of palladium catalyst with polyvinyl alcohol (PVA) as protector, formaldehyde (HCHO) as reducing agent. We used polyethylimine (PEI) to modify the surface of the substrate in advance.In this study, we developed a one-step catalyst by adding PEI into PVA-Pd. In addition to its stability, the catalyst has self-adsorption property. The process can be operated at low concentrations, which can effectively reduce the cost. Because of these characteristics, it can not only control the catalyst better than the commercial palladium catalyst but also simplify the process. The effect of self-adsorption was tested on Rogers RO3003 laminates. RO3003 high frequency laminates are ceramic-filled PTFE composites for use in printed circuit boards in commercial microwave and RF applications. The substrate has excellent characteristics such as stable dielectric constant over various temperatures and frequency and low coefficient of thermal expansion. Due to these properties, RO3003 has a great potential to be applied in 5G generation products. After activating, we used electroless copper plating to metallize the substrate.The study focused on the Cu/Pd ratio of the self-adsorption catalyst PEI+PVA-Pd to quantitatively analyze the adsorption capacity by ICP-OES, and the adhesion was analyzed by T-peel. The results indicates that the process is cost-effective, and the adhesion between substrate and copper foil is also higher. The copper layer by using self-adsorption catalyst will also have a better compactness and the surface will be pinhole-free. Therefore, this process can be successfully applied to electroless copper deposition with self-adsorption catalysts.