Application and simulation technology of multichip module packaging

Abstract

Multichip modules (MCM) allow many bare integrated circuit dies to be mounted onto the top layer, which provides an efficient solution to integration of microelectromechanical systems (MEMS) with microelectronics. The elimination of individual chip packages can significantly reduce inter-chip propagation delay and power consumption of the system. In this paper, new methods of packaging MEMS using advanced MCM foundry processes are described. A special purpose surface micromachined MEMS packaging test chip was designed and simulated. The MEMS test die was packaged with electronics die using the high density interconnect (HDI) technology and the Micro Modules System MCM-D process.