Abstract

The very high intensity x-ray beams that will be present at the Advanced Photon Source and other third generation synchrotron sources will require that the first optical element in the beamline and, possibly, the second optical element as well, be cooled to remove the heat deposited by the x-ray beam. In many of the beamlines this heat will be in the 1 to 5 kW range, and any failure of the cooling system will require a quick response from safety control circuits to shut off the beam before damage is done to the optical element. In many cases, this first optical element will be a silicon diffraction crystal. Viewing the surface of objects subjected to high heat fluxes with an infrared camera or infrared sensor has proved to be a very effective method for monitoring the magnitude and distribution of surface temperatures on the object. This approach has been quite useful in studies of cooling silicon crystals in monochromators subject to high heat loads. The main drawback to this method is that single crystals of silicon are partially transparent to the infrared radiation monitored in most infrared cameras. This means that the infrared radiation emitted from the surface contains a component that comes from the interior of the crystal and that the intensity of the emitted radiation and thus the apparent temperature of the surface of the crystal depends on the thickness of the crystal and the kind of coating on the back (and/or the front) of the crystal. The apparent temperature of the crystal increases as the crystal is made thicker. A series of experiments were performed at Argonne National Laboratory to calibrate the apparent surface temperature of the crystal as measured with an infrared camera as a function of the crystal thickness and the type of coating (if any) on the back side of the crystal. A number of examples are given for data taken in synchrotron experiments with high intensity x-ray beams.

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