Anti-buckling S-shaped vertical microprobes with branch springs

Abstract

We propose the S-shaped vertical probes with branch springs for the wafer-level testing of IC chips. The conventional S-shaped vertical probe requires a guide structure to prevent buckling due to the large overdrive actuation involved. However, the guide structure not only increases the cost of fabrication, but it also requires a troublesome assembly procedure. In this paper, we present the S-shaped vertical probe with branch springs on the left and right sides of the main spring to prevent buckling. This probe was designed using finite-element methods and fabricated using Ni–Co electroplating. The performances of the probe for the wafer-level testing of IC chips were measured with the probe test equipments. Compared to the identical conventional S-shaped probe, the proposed probe has the overdrive (60 μm) that is 1.2 times larger and the contact force (25 mN) that is 2.5 times larger. This new S-shaped vertical probe satisfies the design requirements for a vertical probe without the guide structure and has the potential for use as a cost-effective guide-free probe card for the wafer-level testing of IC chips.