Abstract
Thin Ni-Fe films were produced via electrodeposition onto silicon substrate using direct current and pulse (with different pulse durations) regimes. The correlation between technological regimes and chemical composition and microstructure for Ni-Fe nanogranular films was discussed. Analysis of the microstructure evolution revealed the changing mechanism of the films growth from the Volmer-Weber (describes island film growth) to the Stranski-Krastanov (layer by layer at the growth beginning) with the shortening of the pulse duration less than 10 μs. This anomalous behavior was explained by an increase of the binding energy between the initial atoms and the substrate surface. The results showed that using electrodeposition regimes, which ensure growth with the average crystal size less than the critical value (10 nm), provides less roughness, defectiveness and greater film uniformity in thickness, and, therefore, stable properties.
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