Abstract
It was shown that the method of anodization of aluminum and aluminum alloys can be applied for subsequent plating of highly adherent copper coating instead of the known zincate treatment with additional annealing. Fluorine-containing additives in anodizing electrolyte were proposed as activator of oxide film. The parameters of the anodic film (thickness, porosity, and microroughness) were calculated. The plated quality copper coatings have high adhesion to the aluminum support, and no additional heat treatment is required. This considerably reduces the processing time for deposition of multilayer coatings and decreases the material costs.
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