Abstract
Anodic leveling of a triangular surface profile under secondary and tertiary current distribution conditions has been studied both theoretically and experimentally. Numerical simulation of the leveling process was carried out using the finite element method (FEM). Experiments were performed in a flow cell with advancing anode using anodic dissolution of copper in a nitrate electrolyte as a model system. Results show good agreement between theoretical and experimental rates of leveling of microprofiles. Surface brightening is observed under tertiary current distribution conditions only.
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