Abstract
Methods of quartz microgravimetry (in solutions containing no copper ions) and stripping voltammetry (in copper-containing solutions) are used to study the process of anodic dissolution of thin deposits of pure Co and Ni and deposits of these metals with inclusion of copper in the potential region of copper deposition. It is shown that, under these conditions, Ni practically does not dissolve in either the sulfate or chloride-containing electrolytes, whereas Co dissolves in sulfate electrolytes at a rate that is dependent on the potential and increases with its shift into the positive region. Stability of ternary CoNiCu deposits is examined and it is demonstrated that additionally inserting Ni in the composition of a magnetic CoCu layer facilitates suppression of selective dissolution of Co.
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