Abstract
Using anodic bonding, a strong bond has been created between the ultralow expansion glass ceramic Zerodur® from Schott and an Al coated piece of ultralow expansion glass (ULE® from Corning). The bond strength has been tested using a tensile testing machine. The bond strength is comparable to the fracture strength of the ULE® material. Using anodic bonding it will be possible to make complicated electrostatic clamps for the next generation lithography machines based on an all ultralow expansion design.
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Schedule a callMore From: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
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