Abstract
In spite of the fact that anodic bonding technique has be extensively utilized in the MicroElectroMechanical Systems (MEMS) for the packaging of microsensors and microactuators, some key issues, such as decreasing anodic bonding temperature, improving bonding strength and reducing bubbles in the bonding interface, must be resolved. In the paper, the anidic bonding process of a micro sealing cavity is studied by using an in-house made vacuum packaging equipment. The quality of the anodic bonding interface quality is analyzed by SEM. The shear strength of the bonding samples is measured by a in-house made six-axis micro tester. The analysis results demonstrate that the anodic bonding interfaces are dense, without bubbles, and their shear strength is over 29MPa.
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