Abstract
We described the glass-to-glass anodic bonding through thin p-Si layer. The applied here p-Si forming procedure allows to achieve high quality, strong connection between two glass plates. The p-Si forming procedure have been never reported before. Several test structures of different shape and size were done. Simple microfluidic device were fabricated as well. Crash test of test structure and pneumatic test of the microfluidic device proved high quality of the assembling method.
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