Abstract

The anodic behavior of copper has been studied up to about 1.5 v above the floating potential, mainly in 50% orthophosphoric acid. The floating potential is at about −0.16 v (with respect to 0.1N calomel). Characteristic potentials occur at and . Electropolishing is found between these two potentials and above 0.8 v. The limiting current appears to be governed by the convection of the reaction products away from the electrode, and there seem to be at least two low‐resistance layers which can form on the surface, one associated with and the other with . Below , the cation is primarily Cu+, above it is primarily Cu++.

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