Abstract

A new IEEE journal on signal integrity and power integrity was approved in February 2021 by the IEEE Periodicals Committee, and will be named the IEEE Transactions on Signal and Power Integrity. The new T-SPI will be financially cosponsored by the Electromagnetic Compatibility Society, the Microwave Theory and Techniques Society, and the Council on Electronic Design Automation. The Electronic Packaging Society will be a technical co-sponsor of the T-SPI as well.

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