Abstract
Annealing behaviors of secondary defects in quenched α-brass have been studied by transmission electron microscopy. It is observed that the density and the size of perfect loops in bulk specimens decrease more rapidly than those of faulted loops in the temperature range from 400° to 500°C. It is also observed that the density and the size of stacking fault tetrahedra in bulk specimens increase with annealing temperature up to 400°C, and begin to decrease at about 700°C. The shrinkage rate of tetrahedra is independent of specimen thickness. The apparent activation energies for shrinkage are estimated to be about 1.7 eV for both faulted loops and perfect loops and about 2.0 eV for tetrahedra. Some discussions on the annealing of these defects are given, and it is concluded that the stacking fault tetrahedra shrink by the ledge mechanism.
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