Abstract
In this work, VO2 is deposited on borosilicate glass substrates via a single step Chemical Vapor Deposition (CVD). Though the structural characterization revealed the presence of phase pure polycrystalline VO2 in simple monoclinic crystal structure (P21/c), electrical measurements did not show a sharp transition. To understand the ambiguity, surface characterization was performed with X-ray Photoelectron Spectroscopy (XPS) on the as-deposited VO2 thin films. Vanadium was present in V3+, V4+ and V5+ states. Following these measurements, annealing was performed in ambience at 200 °C for 10 minutes. Subsequent electrical measurements showed an improved phase transition, enhanced by an order of magnitude. We attribute the enhancement in transition to annealing of oxygen vacancies present in VO2 thin films because of the deposition conditions. Decrease in oxygen vacancies was correlated with a decrease in the fraction of V3+ from XPS measurements. The sample annealed at 200°C for 10 minutes exhibited a higher resistance ratio (ΔA = 305) with an optimum hysteresis (4°C) and transition width(12°C), whereas the as-deposited sample exhibited a resistance ratio of ΔA = 32. The thermal treatment affected the characteristics of the transition. A narrow hysteresis of 4°C and a sharp transition width with a reasonable resistance ratio were obtained for the sample annealed at 200°C for 10 minutes. From this study, we understand that our synthesis of VO2 thin films via CVD is prone to be off-stoichiometric and therefore, contains defects such as oxygen vacancies. We could mitigate the effect of these vacancies and engineer the stoichiometry by performing a simple annealing which in turn improved the strength of the phase transition. Drawbacks such as a poor-quality transition, resulting from synthesis parameters can be mitigated if we understand the effect of vanadium and oxygen vacancies.
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