Abstract
Contact angle for millimeter-size drops of lead on {100} and {110} surfaces of monocrystalline copper and on polycrystalline copper was determined by means of dispensed drop technique at 450 °C under He-H2 atmosphere. It was demonstrated that the wetting anisotropy (a difference between contact angles on differently oriented substrates) is not exceed a few degrees. Spreading kinetics was found to be different for the first and second drops deposited on each substrate. This result was interpreted as an effect of a lead precursor film formation on the substrate surface. Molecular dynamics simulations of the lead drop spreading over {111}, {100}, and {110} surfaces of monocrystalline copper confirm the weak anisotropy of equilibrium contact angle and a formation of lead precursor film on copper surface in front of wetting line.
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