Abstract
The microstructural evolution of the intermetallic compound (Cu 6 Sn 5 ) in Sn–xCu solder matrix under current stress was investigated by scanning electron microscopy (SEM) and in situ synchrotron X-ray diffraction (XRD). The phase evolution of the Cu 6 Sn 5 was also investigated under thermal aging for comparison. The only XRD crystalline peak ( 3 ¯ 14 ) of Cu 6 Sn 5 that was detected disappeared under current stress, but not under thermal aging. Ex situ SEM observation of the Cu 6 Sn 5 crystal revealed an anisotropic dissolution behavior. The kinetics of the anisotropic dissolution was also investigated.
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