Abstract
New developments in anisotropic conductive adhesives extend the application area from flex interconnections to chip on glass and flip chip. We have studied the feasibility of chip on glass processes for different types of anisotropic conductive and non-filled adhesives and different types of bumps on the ICs. The contact resistance between the bumps and the ITO pattern is measured with a four-point method using special testglasses and test ICs. It appeared that this type of adhesive bonding is rather insensitive for variations in bonding conditions. The influence of the type of ITO and the layout of the pattern was very distinct. Reliability tests showed a rather small increase in contact resistance after 1000 hours storage at 85°C/85% relative humidity. This technology can also be used for flip chip on other substrates like FR4 or polyimide. The influence of the bonding conditions on the electrical and mechanical behavior is studied. Reliability tests showed that very reliable interconnections can be made on polyimide substrates. Bonding on FR4 gave no reliable contacts.
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