Angular Distributions during Magnetron Sputtering of Polycrystalline Mg, Al, Si, Ti, Cr, Cu, Zn, Ge, Zr, Nb, Mo, Ag, In, Sn, W, Pt, Au, and Bi Targets

Abstract

The results of experimental investigations of the angular distributions during magnetron sputtering of Mg, Al, Si, Ti, Cr, Cu, Zn, Ge, Zr, Nb, Mo, Ag, In, Sn, W, Pt, Au, and Bi targets in argon at a constant current are presented. The operating conditions during the experiments corresponded to the values typical of industrial sputtering equipment. The angular distribution of the material flow was calculated based on the measured thickness of the coating deposited on two flexible ribbon substrates. These substrates were fixed in place on a substrate holder in the form of two crossed half-rings that were equidistant from the center of the magnetron target (the curvature radius was 100 mm). The influence of the magnitude and shape of the magnetic field near the surface of the sputtered cathode on the angular distribution was also investigated. The results can be used as the source data for calculating the profile of the coating during magnetron sputtering.